MPI WAFER PROBE CARDS

MPi Wafer Probe Cards

MPi Wafer Probe Cards

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Canteliver Probe Card

MPI Cantilever Probe Card is commonly utilized on gold bump and pad wafer testing for Show driver, logic, and memory gadget. MPI’s cantilever probes are definitely the corresponding response for the requires of fi­ne pitch, tiny pad sizing, higher pace, a lot less cleaning, multi-DUT, significant pin rely, and ultra-low leakage needs. With fantastic craftsmanship, innovative architecture and proven methodologies according to mechanical and electrical simulation/measurement benefits, earning MPI the top cantilever provider around the world.


FCB Probe Card

The FCB Probe Card is easily the most experienced technological know-how of buckling beam probe card. It truly is aimed to attain the semiconductor ship manufacture time-to-marketplace (TTM) and price of test (COT) demand from customers. FCB is a verified Remedy for many different semiconductor manufacturing tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for gadget demanding high signal integrity probing (SI) and/or electric power integrity probing (PI). Apps include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the globe’s greatest overall Value-of-possession (COO) for different DUT apps.


EVS Probe Card

The EVS Probe Card can be an improvement more than the traditional buckling beam probe card. Critical capabilities are better present-day carrying capacity (C.C.C.) and lessen balanced Speak to drive (BCF), in addition to Total MEMS-like characteristics. EVS can easily satisfy the prerequisite of Highly developed wafer probing. Specific alignment and fantastic planarity control are the vital aspects contributing to secure Get hold of resistance. With its ability and efficiency, EVS Probe Card is a great option for State-of-the-art probe cards.


Osprey probe card

The Osprey probe card is MPI’s Option to need for at any time finer pitch. It can be designed for lesser Al pad, and is particularly perfect for tiny pitch software with peripheral and whole array pattern. With specific alignment and superior planarity Command, Osprey can attain bigger productiveness by multi-DUT design and style.  The forming wire (FW) kind needle manufactured with MPI’s very own micro fabrication process not merely provides substantial-good quality efficiency and also allows straightforward needle replacement and shortens preserving cycle time.



Kestrel Probe Card

The Kestrel Probe Card is supplied with MEMS wire (MW) needle and that is designed for the desire of reduced force probing. What's more, it comes along with the chance to satisfy substantial C.C.C. and higher pin counts application. The MEMS approach makes sure highly constant needle attributes, plus the Distinctive structure design permits exact alignment and planarity Handle.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications here include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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